Sensor housings, modules, and luminaires incorporating the same

ABSTRACT

Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

RELATED APPLICATION DATA

The present application is a continuation application of U.S. patentapplication Ser. No. 15/784,931 filed Oct. 16, 2017.

FIELD

The present invention relates to light emitting diode (LED) luminairesand, in particular, to LED luminaires having architectures forindependent thermal management of sensors disposed therein.

BACKGROUND

Sensors, including, but not limited to, image sensors, temperaturesensors, fluid sensors, mass sensors, airflow sensors, directionalsensors, positional sensors, vibration sensors, electrical sensors,velocity sensors, noise sensors, chemical sensors, humidity sensors,etc., impact various aspects of our daily lives. For example, suchsensors are employed in a variety of different devices and systemsincluding, but not limited to, cameras, satellites, vehicles, heating,ventilation and air conditioning (HVAC) systems, computers, handhelddevices, astronomical imaging devices, surveillance devices, spectralanalysis devices, telecommunication devices, aircraft, etc.

Sensors can also be employed in luminaires utilizing light emittingdiodes (LEDs) and driving components. When energized, the LEDs, drivingcomponents, and sensors independently generate heat, which increases thetemperature of the luminaire. The sensors, and/or components thereof,are susceptible to damage when heated to temperatures exceeding about85° C. Moreover, thermal energy can induce noise in the sensors, whichdiminishes the performance thereof, in some embodiments.

SUMMARY

Sensor housings, modules, and luminaires incorporating the same aredescribed herein. Such housings and modules can advantageously improvethe thermal management within a luminaire, for example, by dissipatingheat generated by a sensor and insulating the sensor from otherheat-generating components of the luminaire. In one aspect, a sensorhousing for incorporation with a luminaire is disclosed. The sensorhousing comprises one or more walls defining a cavity for accepting asensor, wherein a heat sink is integrated with the wall(s) of the sensorhousing. The heat sink is configured to dissipate heat generated by thesensor and/or associated electronics. In some embodiments, the sensorhousing and integrated heat sink are thermally isolated from the otherheat generating elements in the luminaire. As described further herein,the heat sink can form one or more wall portions of the sensor housing.In other embodiments, the heat sink can be coupled to one or more wallsurfaces of the sensor housing. The heat sink can employ any number anddesign of heat dissipating structures including, but not limited to,fins, projections, tabs, splines, tines, pins, needles, or steps or anycombination thereof.

In another aspect, a sensor module is disclosed. The sensor modulecomprises a housing, at least one sensor component disposed in thehousing, and a heat sink in thermal communication with the housing. Theheat sink is configured to dissipate heat from the sensor and/orassociated electronics. In some embodiments, one or more sensingelements and associated electronics are disposed in the housing. Inother embodiments, electronics of the module are disposed in the housingand the sensing element is located remote from the housing. In suchembodiments, the sensing element can be connected to the electronics viaone or more wires or cables. In other embodiments, the sensing elementis in wireless communication with the sensor module electronics. Asdescribed herein, the heat sink can form part of the sensor housing.Alternatively, the heat sink can be coupled to one or more surfaces ofthe sensor housing. In some embodiments, for example, the heat sink canbe permanently coupled or reversibly coupled to the sensor housing. Thesensor module can have design for integration with a luminaire at one ormore locations in the luminaire architecture.

In some embodiments, housings and modules described herein are hybriddevices comprised of different materials. For example, some portions ofthe housing can be metallic and other portions of the housing can benon-metallic. In certain embodiments, the housing comprises a metallicouter wall and fins while other portions are non-metallic and formedfrom plastic, ceramic, etc. In certain embodiments, portions of thehousings and modules are overmolded in plastic for providing an air andmoisture tight enclosure for the sensor.

In some embodiments, the sensing element incorporated in such housingsand modules is a camera. In other embodiments, sensing elementsincorporated in such housings and modules include, without limitation,light sensors, motion sensors, various image sensors, temperaturesensors, magnetic field sensors, gravity sensors, humidity sensors,moisture sensors, vibration sensors, pressure sensors, electrical fieldsensors, sound or noise sensors, environmental sensors, directionalsensors, position sensors, velocity sensors, airflow sensors, chemicalsensors (i.e., sensors that detect toxins or chemical compounds, notlimited to carbon dioxide (CO₂) sensors, oxygen (O₂) sensors, etc.),electrical sensors (i.e., any sensor comprising electrical devicesand/or any sensor that detects electrical events or conditions), or anycombination thereof.

Such sensors can be electrically connected to a plurality of electricalcomponents, including but not limited to a wireless interface (e.g.,wireless antennae) and circuitry supported by a printed circuit board(PCB). Notably, the housings and modules described herein do not inhibittransmission of wireless signals, in some embodiments.

Further, the housings and modules described herein can be configured tomaintain the sensor at temperatures between 25-85° C., 40-80° C., 40-65°C., or temperatures less than 85° C., less than 75° C., less than 65°C., or less than 55° C. Further, the housings and modules describedherein can maintain the sensor at a temperature within 25° C., 20° C.,10° C., or 5° C. of ambient temperature during operation of theluminaire, where the ambient temperature is about 55° C.

In another aspect, a luminaire is disclosed. The luminaire comprises adriver assembly thermally coupled to a first heat sink, a light emittingdiode (LED) assembly thermally coupled to a second heat sink, and asensor module. The sensor module comprises a housing, at least onesensor component disposed in the housing and a heat sink in thermalcommunication with the housing. The module heat sink can be thermallyinsulated from one or each of the first and second heat sinks. In somecases, the first heat sink is also thermally insulated from the secondheat sink. The first, second, and module heat sinks can optionally bedisposed in a vertically stacked configuration.

These and other embodiments are described in more detail in the detaileddescription which follows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of a sensor housing for integration witha luminaire according to some embodiments.

FIGS. 1B-1C are respective front and rear perspective views of a sensorhousing for integration with a luminaire according to some embodiments.

FIGS. 2A-2B are respective front and rear perspective views of a sensorhousing for integration with a luminaire according to some embodiments.

FIGS. 2C-2D are respective front and rear schematic diagrams of aprinted circuit board (PCB) configured to support electrical componentsfor powering a sensor housed in the sensor housing of FIGS. 2A-2Baccording to some embodiments.

FIGS. 3A-3B are sectional views of a sensor module for integration witha luminaire according to some embodiments.

FIG. 3C is an exploded view of a sensor module for integration with aluminaire according to some embodiments.

FIG. 3D is a schematic diagram of a PCB configured to support electricalcomponents for powering a sensor disposed in the sensor modules of FIGS.3A-3C according to some embodiments.

FIGS. 4A-4B are respective front plan and perspective views of a sensormodule for integration with a luminaire according to some embodiments.

FIGS. 5A-5B are respective front plan and perspective views of a sensormodule for integration with a luminaire according to some embodiments.

FIGS. 6A-6B are respective front plan and perspective views of a sensormodule for integration with a luminaire according to some embodiments.

FIGS. 7A-7B are respective front plan and perspective views of a sensormodule for integration with a luminaire according to some embodiments.

FIGS. 8A-8F are perspective views of various sensor modules forintegration with a luminaire according to some embodiments.

FIG. 9A is a perspective view of a luminaire incorporating a sensorhousing and module according to some embodiments.

FIG. 9B is an exploded view of the luminaire in FIG. 9A.

FIG. 9C is a sectional view of the luminaire in FIG. 9A.

FIG. 10 is a perspective view of a luminaire incorporating a sensorhousing and module according to some embodiments.

FIG. 11 is a perspective view of a light emitting face of a luminaireincorporating a sensor housing and module according to some embodiments.

FIGS. 12A-12D are perspective views of various luminaires incorporatingsensor housings and modules according to some embodiments.

FIG. 13 is a perspective view of a luminaire incorporating a sensorhousing and module according to some embodiments.

FIG. 14 is a sectional view of a luminaire incorporating a sensorhousing and module according to some embodiments.

FIG. 15A is a perspective view of a sensor module for integration with aluminaire according to some embodiments.

FIG. 15B is a sectional view of the sensor module in FIG. 15A.

FIGS. 15C-15D are respective front and rear exploded views of the sensormodule in FIG. 15A.

FIG. 16A is a perspective view of a sensor module for integration with aluminaire according to some embodiments.

FIG. 16B is a sectional view of the sensor module in FIG. 16A.

FIG. 16C is an exploded view of the sensor module in FIG. 16A.

FIGS. 17A-17B are respective front and rear views of a carryingstructure for integration with a sensor housing and/or module accordingto some embodiments.

FIGS. 17C-17D are front and rear perspective views of a thermalinterface for integration with a sensor housing and/or module accordingto some embodiments.

FIG. 17E is a perspective view of a first heat sinking portion forintegration with a sensor housing and/or module according to someembodiments.

FIG. 17F is a perspective view of a housing portion of a sensor housingfor integration with a luminaire according to some embodiments.

FIG. 17G is a perspective view of a second heat sinking portion forintegration with a sensor housing and/or module according to someembodiments.

FIG. 18 is a schematic block diagram of an image sensor for integrationin a housing, module, and/or luminaire according to some embodiments.

FIG. 19 is a schematic block diagram of a luminaire employing a sensormodule that houses an image sensor according to some embodiments.

DETAILED DESCRIPTION

Embodiments described herein can be understood more readily by referenceto the following detailed description and examples and their previousand following descriptions. The housings, modules, luminaires, andmethods described herein, however, are not limited to the specificembodiments presented in the detailed description and examples. Itshould be recognized that these embodiments are merely illustrative ofthe principles of the instant invention. Numerous modifications andadaptations will be readily apparent to those of skill in the artwithout departing from the disclosed subject matter.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various features or elements, and thefeatures or elements should not be limited by these terms. Such termsare only used to distinguish one element from another. For example, afirst element could be termed a second element, and, similarly, a secondelement could be termed a first element, without departing from thescope of the present disclosure. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

It will be understood that when an element such as a layer, region, orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present.Likewise, it will be understood that when an element such as a layer,region, or substrate is referred to as being “over” or extending “over”another element, it can be directly over or extend directly over theother element or intervening elements may also be present. In contrast,when an element is referred to as being “directly over” or extending“directly over” another element, there are no intervening elementspresent. It will also be understood that when an element is referred toas being “connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or“horizontal” or “vertical” may be used herein to describe a relationshipof one element, layer, or region to another element, layer, or region asillustrated in the Figures (“FIGS.”). It will be understood that theseterms and those discussed above are intended to encompass differentorientations of the device in addition to the orientation depicted inthe FIGS.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including” when used herein specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms used herein should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthis specification and the relevant art and will not be interpreted inan idealized or overly formal sense unless expressly so defined herein.

As used herein, the term “sensor” refers to any device configured tomeasure and/or detect events, conditions, or changes in its environmentand generate an output. For example, in some cases, such sensors utilizetransducers, piezoelectric materials, thermocouples, and/or varioustypes of electrical circuitry components (e.g., capacitors or resistors)to detect events, conditions, or changes and convert the detectedinformation into an electrical output. Exemplary sensors configured foruse and incorporation with the housings and modules described hereininclude, without limitation, light sensors, motion sensors, imagesensors, temperature sensors, magnetic field sensors, gravity sensors,humidity sensors, moisture sensors, vibration sensors, pressure sensors,electrical field sensors, sound or noise sensors, environmental sensors,directional sensors, position sensors, velocity sensors, airflowsensors, chemical sensors (i.e., sensors that detect toxins or chemicalcompounds, not limited to CO₂ sensors, oxygen O₂ sensors, etc.),electrical sensors (i.e., any sensor comprising electrical devicesand/or any sensor that detects electrical events or conditions), or anycombination thereof.

As used herein, the term “image sensor” refers to a device that detects,converts, and/or conveys data constituting an image. The sensor candetect light passing through and/or reflected by an object, convert thevariations or attenuations of light into signals, and then convey thesignals to a processing entity (e.g., a processor, controller, etc.).Image sensors described herein can detect electromagnetic radiationincluding, but not limited to infrared light, visible light, ultravioletlight, or other types of radiation falling in the electromagneticspectrum. Image sensors are used in electronic imaging devices such ascameras or camera modules. In some embodiments, image sensors describedherein include, without limitation, cameras, semiconductorcharge-coupled device (CCD) sensors, photodiode arrays, active pixelsensors having complementary metal-oxide-semiconductor (CMOS)constructions, or N-type metal-oxide-semiconductor (NMOS, Live MOS)technologies.

Sensor housings and modules described herein, in some embodiments, canfacilitate thermal isolation of the sensor and sensor components fromother heat generating components, such as high-temperature lightemitting diodes (LEDs) and electrical components (e.g., electricalpowering and driving components). Such housings and modules alsoadvantageously dissipate heat generated by the sensors and/or sensorelectronics, while still facilitating wireless communicationstherethrough. The housings and modules described herein are water anddust tight in compliance with IP66 ratings. An IP66 rated housing refersto an image sensor enclosure that has obtained a rating from theInternational Electrotechnical Commission's (IEC) international standard60529 rating board, which declares an image sensor (or any other type ofsensor) to be fully protected from dust and solid matter larger thandust as well as being safe from rain, sprinklers, and powerful waterjets.

I. Sensor Housings for Incorporation in Luminaires

In one aspect, sensor housings for incorporation with luminaires aredescribed herein. Such housings define a cavity for accepting a sensor,wherein a heat sink is integrated with the sensor housing. The heat sinkis configured to dissipate heat from the sensor or sensor housing. Insome embodiments, the sensor housing and heat sink are thermallyisolated from other heat-generating components. For example, and incertain cases, the heat sink is configured to thermally isolate thesensor from other heat-generating components in a luminaire, such asLEDs and/or driving components.

In some cases, sensor housings further and optionally comprise a frontface defining an aperture, a rear face opposite the front face and anouter wall disposed between the front face and the rear face. The outerwall can define the cavity or enclosure between the front and rear facesfor housing an image sensor. As described further herein, the heat sinkcan be integrated with one or each of the front and rear faces as wellas the outer wall. Heat sink structures, for example, can form regionsof the front face, rear face and/or outer wall. For example, a pluralityof heat dissipating structures can extend from the outer wall. Suchdissipating structures can extend radially from the outer wall. Incertain embodiments, the dissipating structures comprise projections,fins, pins, needles, steps, tines, etc. that extend radially outwardfrom and/or substantially orthogonal relative to the outer wall of thehousing. The dissipating structures can comprise linear structures,angled structures, tapered structures, and/or curved structures asdefined by a direction of projection or elongation normal to the outerwall. The dissipating structures can comprise a substantially uniformthickness or a non-uniform thickness in which some portions are thickeror thinner relative to other portions of the projections.

FIGS. 1A-2D illustrate exemplary embodiments of sensor housings. FIG. 1Ais a sensor housing, generally designated 1, which illustrates thegeneral features and functionality of the housings set forth hereinaccording to some embodiments. The housing 1 can be, but does not haveto be incorporated in the modules and/or luminaires described inSections II and III below.

Referring to FIG. 1A, the housing 1 comprises, consists, or consistsessentially of a cavity 2 and a heat sink 3. The cavity is configured tohouse, receive, and/or retain a sensor 4. The sensor 4 can comprise anytype of sensor, including but not limited to, a light sensor, a motionsensor, an image sensor, a temperature sensor, a magnetic field sensor,a gravity sensor, a humidity sensor, a moisture sensor, a vibrationsensor, a pressure sensor, an electrical field sensor, a sound or noisesensor, an environmental sensor, a directional sensor, a positionsensor, a velocity sensor, an airflow sensor, a chemical sensor (i.e., asensor that detect toxins or chemical compounds, such as, for example, aCO₂ sensor, an oxygen O₂ sensor, etc.), an electrical sensor (i.e., anysensor comprising electrical devices and/or any sensor that detectselectrical events or conditions), or any combination of theaforementioned sensors.

The heat sink 3 is configured to dissipate heat from the sensor 4 and/orthe sensor housing 1 while simultaneously thermally isolating orshielding the sensor 4 and/or sensor housing 1 from heat H generated byremote components. In some embodiments, for example, the housing 1 andsensor 4 are disposed in a luminaire, and the heat sink 3 dissipatesheat from the sensor 4 while thermally isolating the sensor 4 from otherportions of the luminaire, such as isolating the sensor 4 from heat Hgenerated by the LEDs and/or driving components.

Notably, the sensor 4 is configured to communicate data wirelessly, viaa wireless interface. The wireless signals can traverse across orthrough the housing 1 without being substantially blocked or inhibited.

In some embodiments, the heat sink 3 forms part of the housing 1. Thatis, the housing 1 is the heat sink 3, and vice versa. Alternatively, theheat sink 3 is manufactured separately from the housing 1. In this case,the heat sink 3 can be permanently or reversibly coupled to the housing1. Regardless of its construction, the heat sink 3 in in thermalcommunication with the housing 1 and the sensor 4.

Further, and in some cases, the heat sink 3 can comprise or be formedfrom a thermally conductive and heat sinking body of material. Exemplarymaterials for the heat sink 3 include, without limitation, metal (e.g.,aluminum (Al), copper (Cu), etc.), metal alloys, thermally conductiveplastics or polymers, thermally conductive composites, etc. The heatsink 3 can optionally comprise a plurality of heat dissipatingstructures, such as projections, fins, etc.

FIGS. 1B-1C illustrate more specific embodiments of a sensor housing,for example, such housings are configured to receive and retain an imagesensor. Referring to FIGS. 1B-1C, a sensor housing generally designated10 is shown. Housing 10 (also referred to as the sensor heat sink and/ora heat sinking enclosure) comprises a hybrid enclosure formed from aplurality of metallic and non-metallic materials. Housing 10 comprises,consists, and/or consists essentially of at least a first housingportion 12, a second housing portion 14, and a third housing portion 16.The first housing portion 12 comprises a front housing cover, the thirdhousing portion 16 comprises a rear housing cover, and the secondportion 14 is an intermediate portion disposed between the opposingfront and rear covers. In some instances, the second housing portion 14defines and/or forms a wall 18 around enclosure or cavity 20 (FIG. 1C)that is sealed via the first and/or third portions 12 and 16,respectively.

A plurality of heat dissipating structures 22 extend from portions ofthe wall 18. The first housing portion 12 is configured to face an areato be imaged and the third housing portion 16 is configured to faceand/or attach to a luminaire. Notably, in some cases, the third housingportion 16 is comprised of a thermally insulating material configured toisolate and/or insulate the housing 10, and image sensor disposedtherein, from the remainder of the luminaire. Alternatively, the housingmay be comprised of a single (non-hybrid) enclosure that can beinsulated from the remainder of the luminaire via a discrete insulatingcomponent, such as a gasket or potting material.

In some embodiments, the first housing portion 12 comprises anon-metallic material, such as a plastic, ceramic, or compositematerial. Alternatively, the first housing portion 12 comprises metal.The first housing portion 12 can comprise any material non inconsistentwith the instant disclosure. The front housing portion 12 has a frontface 24 defining an aperture 26 therein. An image sensor (62, FIG. 3A),or a portion thereof, can be partially disposed or positioned in aportion of the aperture 26 for detecting images. In certain embodiments,images are detected via detecting light passing through an object and/orreflected by an object. Images can be generated based on changes in theamount, intensity, and/or wavelength of light being received, collected,and/or otherwise detected at sensor as received through aperture 26.

As FIGS. 1B-1C further illustrate, the aperture 26 defined in the firsthousing portion 12 can be centrally disposed on, over, and/or in thefirst portion 12 of the housing 10 or, alternatively, the aperture 26can be non-centrally disposed on, over, and/or in the first portion 12of the housing 10, where desired. In certain embodiments, the housing 10is rotationally symmetric about a centrally defined axis A1. In otherembodiments, the housing 10 is asymmetric. In further embodiments, thehousing 10 has one axis of symmetry or multiple axes of symmetry. Incertain cases, A1 is an axis of symmetry.

The second portion 14 of the housing 10 can comprise metal, a metalalloy, or a metallic material. For example, the second portion 14 cancomprise a thermally conductive, heat dissipating material such asaluminum (Al), copper (Cu), tin (Sn), silver (Ag), gold (Au), platinum(Pt), titanium (Ti), nickel (Ni), iron (Fe), alloys thereof, or anyother metal non inconsistent with the instant disclosure. Generally,second portion 14 is a heat sink formed of a material having a thermalconductivity in the range of 3-300 W/m·K or any subrange thereof. Thesecond portion 14 of the housing 10 can comprise any metallic ornon-metallic thermally conductive material not inconsistent with theinstant disclosure, such as a heat dissipating or heat sinking metal,plastic, polymeric, or composite material. The second portion 14 of thehousing 10 forms a continuous outermost wall 18 disposed between thefront face 24 and a rear face 28 opposite the front face. The outer wall18 defines a cavity 20 between the front and rear faces 24 and 28,respectively, for receiving and housing an image sensor (62, FIG. 3A).

Still referring to FIGS. 1B-1C and in some embodiments, the plurality ofheat dissipating structures 22 extend radially outward from the outerwall 18. The heat dissipating structures 22 can comprise projections(e.g., needle or pin projections), raised regions, fins, tabs, or anyother suitable structure configured to extend from the outer wall 18.The heat dissipating structures 22 can radiate outwardly from thecentral axis A1 of housing 10 and are be disposed around the outerperimeter of the wall 18. The heat dissipating structures 22 cancomprise linear structures, non-linear structures, angled structures,tapered structures, inclined structures, and/or curved structuresextending from the outer wall. The projections 22 can comprise any size(i.e., length L, width W, and/or thickness t) as noted in Tables 1-3below. The heat dissipating structures 22 can have uniform thickness ora non-uniform thickness (i.e., tapered thickness), in some embodiments.

TABLE 1 Heat Dissipating Structure Length (mm)  5-150  5-100 5-50 5-101-50 1-25 1-10

TABLE 2 Heat Dissipating Structure Width (mm)  1-150  1-100 1-50 1-251-10 <50 <10 <5

TABLE 3 Heat Dissipating Structure Thickness (mm) 1-50 1-30 1-10 1-5 <50 <10 <5

The heat dissipating structures 22 can be spaced apart at equidistant ornon-equidistant increments. That is, the distance D (FIG. 1C) betweenadjacent structures 22 in a given housing 10 can be uniform or varied,as desired. Several non-limiting distances D are noted in Table 4 below.

TABLE 4 Distance between Heat Dissipating Structures (mm) 1-60 1-40 1-201-10 <100 <50 <25 <10 <5

The number of heat dissipating structures 22 provided per housing 10 canalso vary. For example, a housing 10 can comprise at least two heatdissipating structures, three or more heat dissipating structures, fiveor more heat dissipating structures, 10 or more heat dissipatingstructures, 15 or more heat dissipating structures, 18 or more heatdissipating structures, 24 or more heat dissipating structures, 32 ormore heat dissipating structures, 40 or more heat dissipatingstructures, 50 or more heat dissipating structures, more than 100 heatdissipating structures, more than 200 heat dissipating structures, lessthan 1000 heat dissipating structures, between 5 and 500 heatdissipating structures, between 5 and 200 heat dissipating structures,between 8 and 100 heat dissipating structures, between 8 and 60 heatdissipating structures, or between 10 and 40 heat dissipatingstructures. Any size, shape, and/or quantity of heat dissipatingstructures 22 can be provided per housing 10, not inconsistent with theinstant disclosure. In some cases, the heat dissipating structures 22are extruded. Alternatively, the heat dissipating structures 22 can bemachined, molded, cast, or milled.

Further, the heat dissipating structures 22 can also be arranged in anydesirable shape not inconsistent with the instant disclosure. Forexample, in a plan view, the heat dissipating structures 22 can bearranged in a circular or substantially circular shape, in an oval orsubstantially oval shape, in a square or substantially square shape, inan annular shape, or any other shape not inconsistent with the instantsubject matter. The heat dissipating structures 22 can extendsubstantially orthogonal from the wall 18 or at any acute or obtuseangle with respect to the wall 18.

Still referring to FIGS. 1B-1C in general, and in some embodiments, thethird housing portion 16 can, but does not have to, comprise a thermallyinsulating material. For example, the third housing portion 16 cancomprise a non-metallic material, plastic, ceramic, or any otherinsulating composite material not inconsistent with the instantdisclosure. The third housing portion 16 can thermally insulate and/orisolate the housing 10 and sensor disposed therein from other portionsof the luminaire. Notably, the housing 10 is configured to dissipateheat generated by an image sensor housed therein via heat dissipatingstructures 22 and thermally isolate the housing 10 and sensor from otherportions of the luminaire via the third housing portion 16. In someembodiments, the first and third housing portions 12 and 16,respectively, are configured to seal the inner space 20 defined by thewall 18, and prevent dust and moisture from entering the same. The firstand third housing portions 12 and 16, respectively, can also compriseovermolded plastic and/or be overmolded in plastic, where desired.

Referring now to FIG. 1C, a bottom view of the housing 10 isillustrated. The housing 10 defines a cavity 20 that is sealed viarespective first, second, and/or third housing portions 12, 14, and/or16 although the rear face is not shown sealed for illustration purposesonly. As FIG. 1C illustrates, the heat dissipating structures 22 can beacutely or obtusely angled with respect to each other around the wall18.

One or more communication interfaces 32 are disposed in the housing 10.In some cases, the communication interfaces 32 are wireless interfacesor wireless antennae. Such interfaces 32 can be attached or mounted tothe first housing portion 12, or any other portion of the housing 10and/or the image sensor (62, FIG. 3A) disposed therein. Thecommunication interfaces 32 can be mounted over portions of the housing10, the image sensor (62, FIG. 3A), or any other surface or structuredisposed or supported by the housing 10 (e.g., a printed circuit board(see FIG. 2C), a substrate, a wall, a surface, etc.). Notably, thehousing 10 is sealed via the front cover (i.e., 12), while stillallowing wireless signals to be communicated (e.g., transmitted and/orreceived).

FIGS. 2A-2D illustrate aspects of a further embodiment of a sensorhousing, generally designated 40. Housing 40 comprises a wall 42 thatdefines or forms an enclosure 44 (FIG. 2B) for receiving a sensor.Although the housing 40 is depicted as housing an image sensor, it mayalso house any other type of sensor described above (e.g., chemicalsensors, noise sensors, etc.).

A plurality of heat dissipating structures 46 are defined in the housing40. The heat dissipating structures 46 can be disposed over front, rear,and/or side lateral faces of the housing 40 for dissipating heatgenerated by the image sensor disposed therein. The housing 40 can becomprised or formed fully or partially of metal, such as Al, Sn, Cu, Ag,Fe, or alloys thereof. The housing 40 can also be comprised of plastic,ceramic, or any other material not inconsistent with the instantdisclosure. In some cases, the housing 40 is extruded. Alternatively,the housing 40 can be machined, molded, cast, pressed, or milled. Thehousing 40 can be insulated or isolated from the remainder of theluminaire via a lower portion of the housing as described in FIGS. 1A-1Cor an intermediate member that is disposed between the housing 40 andother portions of the luminaire, such as an intermediate gasket, pottingmaterial, pad, or other insulating structure.

In some cases, a lower portion 48 of the housing 40 is mounted,attached, or otherwise disposed on, over, or in a luminaire. The lowerportion 48 of the housing 40 can comprise and/or be attached to athermally insulating material for thermally insulating the housing 40from other portions of the luminaire to maintain the image sensordisposed therein at temperatures within 25° C., 20° C., 10° C., or 5° C.of ambient temperature during operation of the luminaire.

FIGS. 2C-2D are images of the drive circuitry or electrical componentsassociated with powering the sensor being housed in the housing 40. FIG.2C is a front side of a printed circuit board (PCB), generallydesignated 50. The PCB 50 can support and/or electrically connect aplurality of components, including but not limited to a processor 52,memory element 54, wireless antenna 56, and a controller 58. A busconnector 55 can be disposed on an opposing side of the PCB 50 in someembodiments as indicated in FIG. 2D. FIGS. 2C-2D are for illustrationpurposes only, any type or quantity of electrical components may bedisposed on or over the PCB 50 other than and/or in addition to thoseshown. The housings illustrated herein form or comprise heat sinksconfigured to sink and dissipate heat while also thermally insulate theimage sensors disposed therein from other portions of the luminaire.

FIGS. 1A-2D are for illustration purposes only. Numerous modificationsand adaptations will be readily apparent to those of skill in the artwithout departing from the instant subject matter.

II. Sensor Modules for Incorporation in Luminaires

In another aspect, sensor modules are disclosed. In some embodiments, amodule comprises a housing and at least one sensor component disposed inthe housing, and a heat sink in thermal communication with the housing.Sensor component(s) can comprise sensing element(s) and/or associatedelectronics. In some embodiments, electronics of the module are disposedin the housing and the sensing element is located remote from thehousing. In such embodiments, the sensing element can be connected tothe electronics via one or more wires or cables. In other embodiments,the sensing element is in wireless communication with the sensor moduleelectronics. As described herein, the heat sink can form part of thesensor housing. Alternatively, the heat sink can be coupled to one ormore surfaces of the sensor housing. In some embodiments, for example,the heat sink can be permanently coupled or reversibly coupled to thesensor housing. The sensor module can have design for integration with aluminaire at one or more locations in the luminaire architecture. Theheat sink is configured to dissipate heat from the sensor component(s)and thermally isolate the sensor component(s) from other portions of theluminaire.

In some cases, a plurality of optional heat dissipating structures, notlimited to projections, tabs, or fins radiate outwardly from the sensorhousing. FIGS. 3A-8F and 15A-17G illustrate various embodiments ofsensor modules. Notably, the structures illustrated in FIGS. 3A-8F canalso be sensor housings described in Section I hereinabove.

Referring to FIGS. 3A-3D, a sensor module 60 is shown. The module 60comprises a sensor housing 10 and an image sensor 62 disposed in thehousing 10. Although an image sensor 62 is depicted in the module 60,any other type of sensor described in Section I above may beincorporated within the module 60. For example, airflow sensors,chemical sensors, humidity sensors, etc., may also be incorporated intothe module 60, where desired. The housing 10 can comprise, consist,and/or contain any and/or all aspects of the housings describedhereinabove in Section I. The housing 10 is configured to sink anddissipate heat generated by the image sensor 62 while simultaneouslythermally insulating/isolating the image sensor 62 from additionalheat-generating components in a luminaire, such as LEDs and drivercomponents.

In some instances, the image sensor 62 is a camera that detectselectromagnetic radiation, including but not limited to visible,infrared, or ultraviolet radiation. A lens 61 of the camera is partiallyor fully disposed in and/or aligned with the housing aperture 26. Incertain embodiments, for example, the image sensor 62 can image in thevisible and near infrared regions of the electromagnetic spectrum. Insome embodiments, the image sensor 62 comprises a complementary metaloxide semiconductor (CMOS) construction. Alternatively, the image sensorcomprises a charge coupled device (CCD) architecture. Appropriate imagesensors can include those made by the Aptina division of OnSemiconductor, by OmniVision or others. In some embodiments, luminairesdescribed herein incorporate an effective motion detection system basedupon a visible light focal plane array such as a color or monochromeCMOS camera, in conjunction with imaging lens and digital processing.Appropriate lens assemblies may result in a sensor module field of viewfrom 70 degrees to 120 degrees. Relatively inexpensive camera moduleswith resolution as low as (640×480) or (1290×960) can deliverfundamental ground sampled resolution as small as 2 cm from a height of20 feet, more than sufficient to detect major and minor motions ofpersons or small industrial vehicles such as forklifts.

Additionally, the image sensor 62 can have any desired number of pixels.The pixel number can be selected according to several considerationsincluding sensor size, shape, and desired resolution. The image sensor62 can be sensitive to light in any desired region of theelectromagnetic spectrum. In one embodiment, for example, the imagesensor images in the visible and near infrared regions of theelectromagnetic spectrum. Details of a CMOS-based image sensor areillustrated in the non-limiting embodiments of FIG. 18.

As FIGS. 3A-3B illustrate, the image sensor 62 can be disposed on and/orover a support member 64 and/or a PCB 70. In FIG. 3A, the image sensor62 is shown as being disposed on or directly over the PCB 70.Alternatively, as FIG. 3B illustrates, the image sensor 62 is disposedon or directly over the support member 64. The support member 64 cancomprise a thermally conductive material, such as metal, a thermallyconductive polymer, or composite configured to spread heat. The supportmember 64 can absorb thermal energy or heat generated by the imagesensor 62 and be in physical and/or thermal communication with thehousing wall 18 and heat dissipating structures 22. The support member64 is configured to draw heat away from the image sensor 62 fordissipation by heat dissipating structures 22.

FIG. 3C is an exploded view of the module 60. The module comprises thesensor housing 10, image sensor 62, support member 64, sensor componentsdisposed on a PCB 70, and an optional spacer 68. The spacer 68 cancomprise a partially deformable member, such as a foam, pad, or fibrousmat for filling the space (gap) between the sensor components on the PCB70 and support member 64. The spacer 68 can comprise a thermallyinsulating material, in certain embodiments. Alternatively, the spacer68 is a thermally conductive material that transfers heat to the wall 18of the housing 10. The spacer 68 can also comprise a potting materialformed from a thermoset or thermoplastic material and is generallyselected from the group consisting of epoxy resin, polyurethane resin,silicon resin and polyester systems.

FIG. 3D is a detailed view of the sensor components disposed over thePCB 70. Such components are electrically connected to the image sensor62 for supplying electrical energy and power thereto. In someembodiments, the sensor components comprise a processor 72, one or morewireless interfaces or antennae 74, a memory element 76, a controller78, and additional electrical components 79. The additional components79 can comprise, for example, power conversion components, controllingcomponents, and/or bus circuitry elements. The housing 10 is configuredto maintain the sensor 62 and sensor components at temperatures lessthan 85° C., less than 75° C., less than 65° C., or less than 55° C. Thehousing 10 can further maintain the image sensor 62 and sensorcomponents at temperatures within 20, 10, or 5° C. of the ambienttemperature during operation of the luminaire. In exemplary embodiments,the ambient temperature is less than 85° C., for example, such asbetween 55° C. and 65° C.

FIGS. 4A-8F illustrate various embodiments of sensor modules havingimage sensors disposed therein. Portions of the image sensor are visiblefrom the modules, for example, the image sensor lenses are at leastvisible through the aperture. The sensor housings and/or modules shownin FIGS. 4A-8F are heat sinks comprising symmetrical or substantiallysymmetrical heat dissipating structures (e.g., fins, projections, etc.).The quantity of dissipating structures can vary depending on size,quantity, and/or amount of heat generated by the image sensor andsupporting electronics. FIGS. 4A-7B illustrate modules formed fromhybrid housings comprising metal and plastic materials. FIGS. 8A-8Fillustrate non-hybrid housings, the majority of which are formed frommetal.

FIGS. 4A-4B illustrate a sensor module 80 having a quantity of 32 heatdissipating structures S, FIGS. 5A-5B illustrate a sensor module 90having a quantity of 20 heat dissipating structures S, FIGS. 6A-6Billustrate a sensor module 100 having a quantity of 28 heat dissipatingstructures S, and FIGS. 7A-7B illustrate a sensor module 110 having aquantity of 32 heat dissipating structures S. Each of the modules inFIGS. 4A-7B form heat sinking housings or enclosures having a frontcover, a heat dissipating portion comprised of fins, and a rear cover,which collectively dissipate heat and thermally isolate the modules fromother portions of a luminaire. The front and/or rear covers can compriseplastic that is overmolded to portions of the fins for keeping the imagesensor enclosures air and water tight. Alternatively, the front and/orrear covers are devoid of overmolding. In certain embodiments, the frontand/or rear covers are thermally insulating for insulating the imagesensor heat sink (housing) from the remainder of the luminaire,including the LED and driver assembly heat sinks.

FIGS. 8A-8F are additional exemplary embodiments of sensor modules. Eachmodule houses a sensor. Although an image sensor is shown in theseexemplary embodiments, the sensor is not limited to an image sensor.Rather, the sensor can comprise any other type of sensor as described inSection I above (e.g., light sensors, motion sensors, image sensors,temperature sensors, magnetic field sensors, gravity sensors, humiditysensors, moisture sensors, vibration sensors, pressure sensors,electrical field sensors, sound or noise sensors, physical sensors,environmental sensors, directional sensors, position sensors, velocitysensors, airflow sensors, chemical sensors (e.g., CO₂ sensors, O₂sensors, etc.), electrical sensors, or any combination thereof).

FIG. 8A is a sensor module 120 having extended fins 122. The fins 122can be rotationally symmetric relative to an axis of symmetry passingthrough the center of the module 120. The fins can comprise a width Wthat is greater than 10 mm, greater than 20 mm, greater than 50 mm, orgreater than 150 mm. Any size, shape, and/or quantity of fins 122 notinconsistent with the instant disclosure can be provided.

FIG. 8B is sensor module 125 comprising a plurality of primary fins 126orthogonally disposed relative to the outer wall of the module. Aplurality of secondary (corner) fins 128 are connected, attached, and/orotherwise disposed on the primary fins 126. In certain embodiments, thecorner fins 128 branch outwardly from and are acutely angled relative tothe primary fins 126 to which they are attached. Alternatively, thecorner fins 128 can be attached directly to portions of the sensorhousing, such as the outer wall 127 of the sensor housing.

FIG. 8C is a module 130 comprising a quantity of 10 fins, FIG. 8D is amodule 135 comprising a quantity of 18 fins, and FIG. 8E is a module 140comprising a quantity of 32 fins. The fins extend from the base of themodule to the front face comprising the aperture. The fins can berotationally symmetric around the image sensor for uniform heatdissipation. Alternatively, the fins can be non-symmetric. Any size,shape, and/or quantity of fins can be provided, as desired, forfacilitating improved and application-specific heat sinking. The sensorhousings and modules can be incorporated in high-bay luminaires, low-bayluminaires, down lighting luminaires, indoor luminaires, or outdoorluminaires, in some instances.

FIG. 8F is a module 145 comprising elongated fins 146. The fins 146 cancomprise a height or length L that is greater than 10 mm, greater than20 mm, greater than 50 mm, or greater than 150 mm. Any size, shape,and/or quantity of fins 126 not inconsistent with the instant disclosurecan be provided.

As FIG. 8F illustrates, the sensing module comprises an outer wall 148having a wall height L2 as measured along the z-axis defined between thefront face and the rear face of the module. Each of the plurality offins 126 comprises a fin height or length L as measured along thez-axis, and the fin height of each fin is or greater than the wallheight. Alternatively, as the other embodiments illustrate, each fin isapproximately the same height as the outer wall from which the finsextend. The fins 126 can be at least 5 mm greater in length than thehousing body or wall (18, FIG. 1B), at least 10 mm greater in lengththan the housing body, at least 1 inch greater in length than thehousing body, or between 1-6 inches greater in length than the housingbody.

FIGS. 9-14 are luminaires incorporating sensors housings and/or modulesaccording to some embodiments and are described in more detail insection III below.

FIGS. 15A-17G illustrate further embodiments of sensor modules forintegration with luminaires. Referring to FIGS. 15A-15D in general,various views of a further embodiment of a sensor module, generallydesignated 300, is shown. Module 300 comprises a first portion 302, asecond (intermediate) portion 304, and a third portion 306. The firstportion 302 is an image sensor cover or enclosure, the second portion304 is a heat sinking portion, and the third portion 306 is a thermallyinsulating portion configured to thermally isolate the module 300 fromthe rest of the luminaire.

The first portion 302 of the module 300 can define a housing orenclosure for disposal around an image sensor 310. A lens 312 of theimage sensor 310 is aligned with an aperture 308 defined in a front face309 of the first portion 302. The first portion 302 of the module 300further comprises one or more attachment regions 314 configured toreceive one or more attachment or fastening members F (15C). Theattachment regions 314 can, in some embodiments, protrude from the frontface 309 and side regions of the first portion 302 of the module 300.Notably, the attachment regions 314 can protrude in directions that aresubstantially parallel and/or normal to a central axis Ax of the module300. The attachment regions 314 form protective protrusions/projectionsthat protect the lens 312 of the image sensor 310 from physical ormechanical damage during use. Such regions 314 also receive and retainfastening members F via openings 314A defined therein. The fasteningmembers F can extend through respective openings aligned in each of thefirst, second, and third portions of the module 300 when the module isassembled. Views of an assembled module are depicted in FIGS. 15A and15B.

Still referring to FIGS. 15A-15D and in some cases, the second portion304 of the module 300 forms or defines a heat sinking body constructedfrom a thermally conductive material, such as metal, a thermallyconductive composite, or a thermally conductive polymer or plastic. Thesecond portion 304 of the module 300 can comprise a body structure 316and one or more heat dissipating structures 318 extending from the bodystructure 316. The body structure 316 can surround and/or encircleportions of the image sensor 310 and a PCB 320 supporting the imagesensor, such that heat is channeled away from the sensor and sensorelectronics during use. Heat can readily dissipate from the module viadissipating structures 318. The body structure 316 is also in thermalcontact with the PCB 320 supporting the image sensor 310 and alsovarious electronic sensor components 322 that power the sensor 310.

The third body portion 306 can be formed from an insulating material,such as a plastic, polymer, ceramic, or potting material. The third bodyportion 306 insulates and/or thermally isolates the module 300 fromother portions of the luminaire to which it is attached. The module 300and portions thereof, improve the ease of assembly by virtue of beingassembled in one plane via fasteners F without having to rotate portionsthe housing.

As FIG. 15B illustrates and in some cases, one or more ingress sites 326of the module 300 are disposed along a same plane P. The ingress sites326 sealed sites configured to form an air and dust tight cavity 324around the image sensor 310 and PCB 320. The cavity 324 is definedbetween portions of the PCB 320, image sensor 310, and the front cover(i.e., first portion 302). Notably, the image sensor 310, sensorcomponents 322, and PCB 320 are disposed over and/or in contact with theheat sinking body structure 316. The fasteners F can comprise threadedscrews that are inserted and assembled in a top-down configuration (FIG.15C) or a bottom up configuration (15D).

FIGS. 16A-16C illustrate aspects relating to yet a further embodiment ofa sensor module, generally designated 400. In this embodiment, the heatsinking portions of the module 400 are separable from each other andthus attachable and detachable relative to each other and a housingmember 402 of the module 400. The module comprises a housing member 402,multiple discrete heat sinking portions 404A, 404B, and a base 406. Thehousing member 402 can seal an image sensor therein, the heat sinkingportions 404A, 404B can dissipate heat generated by the image sensor,and the base 406 can thermally insulate the module 400 from otherportions of a luminaire.

The housing member 402 comprises an aperture 408 and one or more stands,tabs, or projection regions or portions 410 that extend above portionsof the housing member 402 to protect a lens 412 of an image sensor 414(FIG. 16B) from damage. The housing member 402 can contact, engage,and/or thermally communicate with the heat sinking portions 404A, 404Bof the module 400. One or more sealing members 405 (FIG. 16B) can becompressed between portions of the housing member 402 and heat sinkingportions 404A, 404B upon sealing to tightly seal the module 400. Thesealing members 405 can comprise O-rings, gaskets, or any other type ofcompressible/depressible seals comprised of elastomeric, polymeric,plastic, or potting material not inconsistent with the instantdisclosure.

The first and second heat sinking portions 404A and 404B can be disposedor located around a perimeter of the housing member 402. Each heatsinking portion 404A, 404B comprises, consists, or consists essentiallyof a body 416 and a plurality of heat dissipating structures 418extending from the body 416. The heat dissipating structures 418 cancomprise and/or be formed from fins or blades having non-uniformthicknesses, where thicker and thinner portions or regions along alength and/or width thereof collectively define convective channels bywhich heat dissipates into the surrounding air.

Each heat sinking portion further comprises one or more coupling regions420 whereby one heat sinking portion (e.g., 404A) is fastened,connected, joined, attached, or otherwise coupled to at least one otherheat sinking portion (e.g., 404B) end-to-end. The coupling regions 420can be connected via one or more fastening members (not shown), such as,but not limited to one or more clips, ties, pins, hooks, screws, rivets,nuts, bolts, etc. The fastening members (not shown) can move or compressthe heat sinking portions 404A, 404B towards each other for compressingthe sealing members 405 against the housing member 402 and facilitatinga tightly sealed module 400. Although only two heat sinking portions(i.e., 404A and 404B) are illustrated, more than two heat sinkingportions can be provided per module 400, where desired. As FIG. 16Billustrates, the heat dissipating structures 418 of heat sinkingportions 404A, 404B can be substantially horizontally aligned with theimage sensor 414 and fully surround the sensor for improved thermalmanagement.

FIG. 16C is an exploded view of module 400. As FIG. 16C illustrates, themodule 400 comprises a housing member 420, one or more detachable,discrete, and/or separable heat sinking portions 404A, 404B, and athermally insulating base 406. The image sensor 414 is disposed on orover a carrier or carrying structure 422. The image sensor 414 isconfigured to be received in and fittingly engage portions of thecarrying structure 422. In certain embodiments, the image sensor 414snaps in/out of the carrying structure 422. The carrying structure 422can be thermally conductive or improved heat spreading, or not thermallyconductive.

In some instances, the carrying structure 422 is disposed on or over acontrol PCB 424. The control PCB 424 supports the image sensor 414 andvarious sensor components as previously described above (e.g., aprocessor, memory, etc.). The PCB 424 can comprise a metal core printedcircuit board or FR4 board having traces and/or electrical connectorsdisposed thereon/in for powering and/or controlling aspects relating tothe image sensor 414.

The PCB 424 can be disposed on or over a gap pad 426. The gap pad 426can comprise or be formed from a thermally conductive material disposedbetween the PCB 424 and a thermally conductive supportive plate 428. Thegap pad 426 can form a thermal interface between various components inthe module 400 while advantageously eliminating air gaps to reducethermal resistance in the module 400. The gap pad 426 can also be aconformable and cushioning material for reduce interfacial resistanceand providing low-stress vibration dampening for the sensor componentsand/or the image sensor 414 that are each disposed on or over the gappad 426, where desired.

The image sensor 414 can be sealed between portions of the housingmember 402 and the supportive plate 428. The supportive plate 428 canimprove thermal management in the module 400 via spreading heat to heatsinking portions 404A, 404B for dissipation from the module 400. Ofnote, the carrying structure 422, gap pad 426, and/or supportive plate428 are each optional, and not necessarily disposed in each module asdescribed herein.

FIGS. 17A-17G illustrate aspects relating to each of the respectivecarrying structure 422, PCB 424, gap pad 426, supportive plate 428,first heat sinking portion 404A, housing member 402, and second heatsinking portion 404B.

As FIG. 17A illustrates, the carrying structure 422 can comprise animage sensor retaining region 422A. The retaining region 422A is sizedand/or shaped to receive and/or retain portions (e.g., a base orfootprint) of the image sensor 414 (FIG. 16C). The retaining region 422Acan comprise one or more retaining legs 422B that deform to provide asnap-fit retaining structure around an image sensor base.

As FIG. 17B illustrates, the PCB 424 comprises a front face 423 overwhich the carrying structure 422, image sensor 414, and various sensorelectronics 424A are supported. An electrical connector 424B extends orprotrudes from the PCB 424 and connects to an electrical receptacle orsocket (not shown) in the luminaire, which powers the image sensor andrelated electronics. The electrical connector 424B extends throughapertures in the gap pad 426 and supportive plate 428.

FIG. 17C is the gap pad 426. The gap pad serves as a deformable andcushioning thermal interface between the PCB 424 and supportive plate428. In FIG. 17D, the supportive plate 428 serves as a heat spreadingand supportive structure for the image sensor in the module 400.

FIGS. 17E and 17G illustrate the first and second heat sinking portions404A and 404B. The first heat sinking portion 404A comprises opposingcoupling ends 420 which connect to and/or engage similar coupling ends420 disposed on the second heat sinking portion 404B. Each heat sinkingportion comprises a support 429, which is a planar or non-planarstructure configured to support the supportive plate 428 and othercomponents disposed in the module 400.

FIG. 17F illustrates the housing member 402. The housing member 420 canbe centrally or non-centrally disposed between the first and second heatsinking portions 404A, 404B. The housing can comprise a plurality ofprojecting portions 410 which protect the lens of the image sensor fromdamage. A plurality of retaining slots, channels, or grooves 430 areformed or otherwise disposed in portions of the housing member 402 forreceiving and retaining sealing members 405 (FIG. 16B) that sealportions of the module 400 from moisture, liquids, solids, and/or dust.

FIGS. 4A-17G are for illustration purposes only. Numerous modificationsand adaptations will be readily apparent to those of skill in the artwithout departing from the instant subject matter.

III. Luminaires Comprising Sensor Modules

In a further aspect, luminaires incorporating sensor housings andmodules are described herein. Such luminaires can comprise any of thehousings and/or modules described hereinabove in Sections I and II. Anysize, shape, and/or type of luminaire not inconsistent with the instantdisclosure can incorporate the sensor housings and modules described inSections I and II.

A luminaire comprises a driver assembly thermally coupled to a firstheat sink, a light emitting diode (LED) assembly thermally coupled to asecond heat sink, and a sensor module. The sensor module comprises ahousing, at least one sensor component disposed in the housing and aheat sink in thermal communication with the housing. The module heatsink can be thermally insulated from one or each of the first and secondheat sinks. In some cases, the first heat sink is also thermallyinsulated from the second heat sink. The first, second, and module heatsinks can optionally be disposed in a vertically stacked configuration.The sensor incorporated with the luminaires described herein cancomprise an image sensor (e.g., a camera) or any other type of sensordescribed in Sections I and/or II above. Additionally, more than onesensor may be provided per luminaire, where desired.

FIGS. 9A-9C are perspective, exploded, and sectional views,respectively, of a luminaire generally designated 150. The luminaire 150comprises a driver assembly 152, a light emitting assembly 154, and animage sensing assembly (i.e., the image sensing module 60). Theluminaire 150 further comprises a light emitting face 156 from which aplurality of LEDs 158 emit light. In some cases, the LEDs 158 arearranged in an array, where adjacent LEDs 158 are spaced apart from eachother at uniform or non-uniform distances. The LEDs 158 can be used inconjunction with one or more lenses or optics (not shown) to outputlight having a desired lighting distribution, pattern, or outputcharacteristics.

As FIG. 9B illustrates, the driver assembly 152 comprises a driver 160that is thermally coupled to a driver heat sink 162 (a first heat sink).The driver 160 can comprise a plurality of electrical components andcircuitry (e.g., capacitors, resistors, integrated circuits, etc.) thatpower the luminaire 150 causing the LEDs 158 to emit light. The driver160 can comprise a circuit assembly optimized for lower power and wideinput voltage. The driver assembly 160 generates heat, which isdissipated via the driver heat sink 162. The driver heat sink 162comprises a plurality of heat dissipating structures or fins, which areoptionally rotationally symmetric relative to a central axis of theluminaire 150. Non-rotationally symmetric fins are also contemplated.The driver heat sink 162 is thermally insulated and/or isolated from theremaining portions of the luminaire 150 via an insulating member 164.The driver assembly 160 can be vertically positioned in a central regionof the luminaire 150.

The driver heat sink 162 can be formed of any suitable material notinconsistent with the objectives of the present invention. Generally,the driver heat sink 162 can be formed of a material having a thermalconductivity in the range of 3-300 W/m·K. In some embodiments, thedriver heat sink 162 is fabricated from aluminum or other metal oralloy. For example, the driver heat sink 162 can be fabricated fromaluminum or other metal via extruding, machining, casting, pressing,forging, or milling. Alternatively, the driver heat sink 162 can beformed of a polymeric material or composite and produced via die-castingor molding techniques. The driver heat sink 162 can comprise singlefins, branched fins, tapered fins, and/or curved fins.

In some embodiments, a potting material is applied to portions of thedriver assembly 160, driver heat sink 162, and/or an insulating member164 disposed between the driver assembly 152 and remainder of luminaire150. Potting material, in some embodiments, can enhance the ingressprotection rating of the driver by providing a waterproof barrierprotecting the driver and other electrical components. Potting materialcan additionally assist in thermal management of the driver bytransferring heat generated by the driver 160 to the heat sink 162.Potting material can comprise a thermoset or thermoplastic material andis generally selected from the group consisting of epoxy resin,polyurethane resin, silicon resin and polyester systems.

Any of the embodiments disclosed herein may include power or drivercircuitry having a buck regulator, a boost regulator, a buck-boostregulator, a fly-back converter, a SEPIC power supply or the like and/ormultiple stage power converter employing the like, and may comprise adriver circuit as disclosed in U.S. patent application Ser. No.14/291,829, filed May 30, 2014, entitled “High Efficiency Driver Circuitwith Fast Response” by Hu et al. (Cree docket no. P2276US1) or U.S.patent application Ser. No. 14/292,001, filed May 30, 2014, entitled“SEPIC Driver Circuit with Low Input Current Ripple” by Hu et al. (Creedocket no. P2291US1) incorporated by reference herein. The circuit mayfurther be used with light control circuitry that controls colortemperature of any of the embodiments disclosed herein, such asdisclosed in U.S. patent application Ser. No. 14/292,286, filed May 30,2014, entitled “Lighting Fixture Providing Variable CCT” by Pope et al.(Cree docket no. P2301US1) incorporated by reference herein.Additionally, any of the embodiments described herein can include drivercircuitry disclosed in U.S. Pat. No. 9,730,289, titled Solid State LightFixtures Having Ultra-Low Dimming Capabilities and Related DriverCircuits and Methods (Cree docket no. P2597US1), filed on Feb. 8, 2016and assigned to the same assignee as the present application, theentirety of this application being incorporated herein by reference.

Still referring to FIG. 9B and in some embodiments, the light emittingassembly 154 comprises a light emitter heat sink 166 (a second heatsink) that is thermally insulated and isolated from the remainingportions of the luminaire 150 via a second insulating member 168. Thelight emitter heat sink 166 comprises a base 170 and a central aperture172 disposed therein for passing convective air currents to the driverheat sink 162. A portion of the driver heat sink 162 is received in theaperture 172 of the light emitter (LED) heat sink 166.

The light emitter heat sink 166 can be formed of a material having athermal conductivity in the range of 3-300 W/m·K. For example, the heatsink 166 can comprise aluminum or a high conductively plastic having asthermal conductivity of about 8 W/m·K, or between 5-300 m·K, 5-200 m·K,5-100 m·K, 5-50 m·K, or <300 m·K. In some embodiments, the light emitterheat sink 166 is fabricated from aluminum or other metal or alloy. Forexample, the light emitter heat sink 166 can be fabricated from aluminumor other metal via extruding, machining, pressing, or milling.Alternatively, the light emitter heat sink 166 can be formed of apolymeric material or polymeric composite and produced by die-casting ormolding techniques. The light emitter heat sink 166 can comprise singlefins, branched fins, tapered fins, and/or curved fins. In someembodiments, the light emitter heat sink 166 has fins on a face opposingthe light emitting face 156 (FIG. 9A), although fins may be provided onany surface thereof not inconsistent with the objects of the instantsubject matter.

The luminaire 150 can comprise one or more LED panels 174 having arraysof LEDs 158 disposed thereon. The panels 174 can be coupled to the base170 of the heat sink 166. In the embodiment illustrated in FIGS. 9A-9C,two LED panels 174 are arranged around the central aperture 170 of theheat sink base 166. A single LED panel 174 or more than two panels 174are also contemplated.

The LED panels 174 can be fabricated to match any desired size and/orshape of the heat sink base 170. For example, in some embodiments, theheat sink base and panels can be annular, circular, or elliptical,wherein the LED panels 174 are provided in arcuate shapes for couplingto the base. In other embodiments, the LED panels 174 are substantiallysquared. Pins can be used to secure the LED panels 174 in place forrough alignment followed by electrical connection of the panels 174 tothe driver 160. Thermal paste or glue can be used to improve theadhesion and/or thermal coupling of the panels to the heat sink 166.

In some embodiments, the LEDs 158 of the LED panels 174 comprisepackaged LED chip(s) or unpackaged LED chip(s). The LEDs 158 of thepanels 174 can use LEDs of the same or different types and/orconfigurations. The LEDs 158 can comprise single or multiplephosphor-converted white and/or color LEDs, and/or bare LED chip(s)mounted separately or together on a single substrate or package thatcomprises, for example, at least one phosphor-coated LED chip eitheralone or in combination with at least one color LED chip, such as agreen LED, a yellow LED, a red LED, etc.

The LED module 150 can comprise phosphor-converted white or color LEDchips and/or bare LED chips of the same or different colors mounteddirectly on a printed circuit board (e.g., chip on board) and/orpackaged phosphor-converted white or color LEDs mounted on the printedcircuit board, such as a metal core printed circuit board or FR4 board.In some embodiments, the LEDs 158 can be mounted directly to the heatsink 166 or another type of board or substrate. Depending on theembodiment, the lighting device can employ LED arrangements or lightingarrangements using remote phosphor technology as would be understood byone of ordinary skill in the art, and examples of remote phosphortechnology are described in U.S. Pat. No. 7,614,759, assigned to theassignee of the present invention and hereby incorporated by reference.

In those cases where a soft white illumination with improved colorrendering is to be produced, one or more of blue shifted yellow LEDs andone or more red or red/orange LEDs may be provided as described in U.S.Pat. No. 7,213,940, assigned to the assignee of the present inventionand hereby incorporated by reference. The LEDs 158 may be disposed indifferent configurations and/or layouts as desired, for exampleutilizing single or multiple strings of LEDs where each string of LEDscomprise LED chips in series and/or parallel.

Different color temperatures and appearances could be produced usingother LED combinations of single and/or multiple LED chips packaged intodiscrete packages and/or directly mounted to a printed circuit board asa chip-on board arrangement. In one embodiment, the light sourcecomprises any LED, for example, an XQ LED incorporating TrueWhite® LEDtechnology or as disclosed in U.S. patent application Ser. No.13/649,067, filed Oct. 10, 2012, entitled “LED Package with MultipleElement Light Source and Encapsulant Having Planar Surfaces” by Lowes etal., (Cree Docket No. P1912US1-7), the disclosure of which is herebyincorporated by reference herein, as developed and manufactured by Cree,Inc., the assignee of the present application. If desirable, other LEDarrangements are possible. In some embodiments, a string, a group ofLEDs or individual LEDs can comprise different lighting characteristicsand by independently controlling a string, a group of LEDs or individualLEDs, characteristics of the overall light out output of the device canbe controlled.

Still referring to FIG. 9B, the sensor module 60 can be disposed betweenportions of the LED panels 174 and mounted on or over the light emitterheat sink 166. In certain embodiments, the sensor module 60 is centrallydisposed between the LED panels 174 although non-centrally disposedmodules 60 are contemplated. The sensor module 60 can be integrated atany position in the luminaire 150 not inconsistent with the objectivesof the present subject matter. For example, the sensor module 60 can beintegrated into the luminaire at a position at least partiallyoverlapping the light emitting face 156, in an aperture of the lightemitting portion 154, or adjacent to the driver portion 152. The sensormodule 60 may be mounted directly or indirectly to the light emitterheat sink 166. Notably, the sensor module 60 is thermally insulated fromeach of the driver and light emitter heat sinks 162 and 166,respectively, via thermally insulating portions of the module 60 or aseparate and discretely positioned isolator. In some embodiments,thermally insulating material is disposed between the sensor and heatsinks of the driver and LEDs. For example, potting material or thermallyinsulating material may separate the sensor and associated electronicsfrom the driver and LED heat sinks 162, 166. The thermally insulatingmaterial may be contained in the module 60. In other embodiments, thethermally insulating material be positioned between the module 60 andluminaire components. The sensor module 60 can be integrated at anyposition in the luminaire not inconsistent with the objectives of thepresent invention. The sensor module 60 and the LED panels 174 can besealed within the luminaire 150 via gaskets 176 and 178.

FIG. 9C is a sectional view of the luminaire 150. Each of the multiple,discrete heat sinks, the (first) driver heat sink 162, the (second)light emitter heat sink 166, and the sensor module heat sink 14 aredisposed in a vertically stacked configuration. The light emitter heatsink 166 partially or fully surrounds the driver heat sink 162. The heatsinks (i.e., 162, 166, and 14) are spaced apart from each other andthermally insulated from each other for improving the thermal managementin luminaire 150.

FIGS. 10 and 11 are further embodiments of luminaires, generallydesignated 180 and 200, respectively. Each luminaire comprises an imagesensor (62, FIG. 3A) disposed in a sensor housing 10. As FIG. 10illustrates, the luminaire 180 comprises a driver assembly thermallycoupled to a first heat sink 182, an LED assembly thermally coupled to asecond heat sink 184 and an image sensor (62, FIG. 3A) thermally coupledto a module heat sink 188. The first, second, and module heat sinks 182,184, and 188 are thermally insulated from each other. The first, second,and module heat sinks 182, 184, and 188 can be, but do not have to be,disposed in a vertically stacked configuration without physical contact.The spaces or gaps between the multiple heat sinks facilitate convectivecooling of driver components, LEDs 190, and the image sensor. In certainembodiments, the image sensor in luminaire 180 can detect motion,whereby the LEDs 190 are energized and emit light when a building orroom is occupied and de-energized, to emit little or no light when abuilding or room is unoccupied for increased energy savings.

FIG. 11 is a view of a light emitting face 202 of the luminaire 200. Animage sensing module comprising a sensor housing 204 and an image sensor206 disposed in the housing. A plurality of LEDs 208 can surroundportions of the housing 204. The sensor housing 204 can comprise aplurality of fins for dissipating heat from the image sensor 206 thusimproving thermal management in the luminaire 204. The housing 204 canbe mounted or attached to the luminaire 200 via one or more pins, bolts,screws, or other fastening member 208. A gasket 210, optionallycomprised of potting material, is disposed around portions of thehousing 204 to thermally isolate and/or insulate the sensor module fromother portions of the luminaire. The sensor housing 204 can be attachedto portions of the LED heat sink, but be thermally insulated therefromvia gasket 210 and/or a thermally insulating portion 212 of the housing.

FIGS. 12A-12D illustrate various positions and/or locations of thesensor modules and/or portions thereof. According to FIG. 12A, thesensor module 215 can be disposed proximate a lower portion of aluminaire 216. The sensor module 215 can at least partially overlapand/or extend from the light emitting face 219 of the luminaire 216. AsFIG. 12A illustrates, the sensor module 215 comprises, includes,consists, and/or consists essentially of an image sensor and a heat sinkcomprised of a plurality of fins 217 that are vertically stacked inrelation to a LED heat sink 218 and a driver heat sink 220.

FIGS. 12C-12D illustrate a luminaire 230 comprised of a non-integratedsensor module. In this embodiment, a sensor housing 231 and a sensor 232housed therein are separate and remote from the image sensor electricalcomponents and sensor heat sinking structure 233.

The luminaire 230 comprises a first heat sinking structure 237configured to sink heat from one or more LEDs, a second heat sinkingstructure 236 configured to sink heat from a driver assembly, and asensor module heat sinking structure. The module heat sinking structureis the sensor heat sinking structure 233, which is configured to sinkheat from the sensor electronics. In this embodiment, the sensor moduleheat sinking structure 233 is adjacent to second (driver) heat sinkingstructure 236.

As FIGS. 12C and 12D illustrate, the sensor heat sinking structure 233is attached to portions of the driver heat sink (236) via one or moresupports 234, such as brackets, bars, struts, shafts, or beams. Thedriver heat sink 233 comprises a plurality of heat dissipatingstructures 235, such as fins, blades, or tabs. As FIGS. 12C-12Dillustrate, the sensor electronics are remotely located, while the imagesensor is disposed at the central and lower part of the luminaire.Sensor and sensor electronics may communicate via one or more cables orwires 234′. In other embodiments, sensor and sensor electronicscommunicate wirelessly.

FIG. 13 illustrates a further embodiment of a luminaire 240 comprising asensor module comprised of a sensor housing 242 and an image sensor 244disposed in the sensor housing. The lens of the image sensor is visiblethrough an aperture of the sensor housing 242. The sensor housing 242forms a heat sink or a heat sinking enclosure for housing the imagesensor 242. The heat sinking enclosure comprises a plurality of fins248. The fins can be disposed around the perimeter of the housing 242,including the sides, upper face, and/or corners of the housing 242. Thefins 248 dissipate heat generated by the image sensor 244 into thesurrounding environment. A separate heat sink dissipates heat generatedby a plurality of LEDs 246 disposed around the housing 242.

FIG. 14 illustrates a further sectional view of an exemplary luminaire,generally designated 250. Luminaire 250 comprises an image sensingmodule 252 extending from and/or disposed on or over a light emittingface 254 of the luminaire. LEDs 256 are disposed over the light emittingface 254 and around the sensing module 252. The sensing module 252comprises a housing 258 that forms a heat sinking enclosure for an imagesensor 260. The housing 258 is configured to dissipate heat generated bythe image sensor 260. The housing further comprises an insulatingportion or region 262 that faces an LED heat sink 264. A heat shield 266is positioned or disposed between the sensor module 252 and the LED heatsink 264. The heat shield 266 is also positioned or disposed between theLED heat sink 264 and an LED driver 268. The heat shield 266 cancomprise any thermally insulating material, such as a polymericmaterial, plastic, a potting material, or ceramic.

The sensor housings and modules described herein can be integrated atany position in the luminaire not inconsistent with the objectives ofthe present invention. The sensor housings and modules are at leastpartially comprised of an insulator, although separate insulators analso be used. The sensor module, for example, can be integrated into theluminaire at a position at least partially overlapping the lightemitting face. In some embodiments, the sensor module is positioned inan aperture of a light emitting diode assembly.

In any of the embodiments disclosed herein each of the light emittingportions or can have different or the same light distribution, althougheach may have a directional emission distribution (e.g., a side emittingdistribution), as necessary or desirable. More generally, anylambertian, symmetric, wide angle, preferential-sided or asymmetric beampattern LED element(s) or module(s) may be used as the light source.

The luminaires having thermal management designs and architecturesutilizing multiple discrete and thermally insulated heat sinks (i.e., afirst heat sink for the driver, a second heat sink for the LEDs, and amodule heat sink for the image sensor) described and illustrated hereincan offer various performance advantages and lighting efficiencies.Thermal management efficiencies realized by luminaires described hereincan permit operation at high ambient temperatures while extending driverand LED lifetimes. In some embodiments, the luminaires described hereincan have an ambient temperature rating of 60-70° C. or 65-75° C. Inaddition to enhanced thermal management, the luminaires described hereincan provide desirable lighting characteristics including an output of15,000 to 70,000 lumens at efficiencies of at least 125 lumens per watt(LPW), such as 150-180 LPW. Table 5 provides additional lightingproperties of luminaires having designs and constructions describedherein.

TABLE 5 Luminaire Lighting Properties Output Correlated Color Temp.Color Rendering Index (lm) LPW (CCT) (CRI) 18,000 140 4000K, 5000K 8024,000 140 3500K, 4000K, 5000K 80 35,000 140 3500K, 4000K 80 70,000 1403500K, 4000K 70

In addition to desirable lighting characteristics, the luminairesdescribed herein provide several additional advantages. For example, asingle luminaire comprised of multiple separate and discrete heat sinksimproves thermal management in the luminaire, allowing the LEDs andimage sensor to remain cooler, having improved operability andefficiency.

Details of a CMOS-based image sensor and associated processing areillustrated in the non-limiting embodiment of FIG. 18. While aCMOS-based image sensor 270 is illustrated, those skilled in the artwill appreciate that other types of image sensors, such as CCD-basedsensors, may be employed. The image sensor 270 generally includes apixel array 271, analog processing circuitry 272, an analog-to-digitalconverter (ADC) 273, digital processing circuitry 274 and sensor controlcircuitry 275. In operation, the pixel array 271 will transform lightthat is detected at each pixel into an analog signal and pass the analogsignal for each pixel of the array 271 to the analogy processingcircuitry 272. The analog processing circuitry 272 will filter andamplify the analog signals to create amplified signals, which areconverted to digital signals by the ADC 273. The digital signals areprocessed by the digital processing circuitry 274 to create image datacorresponding to the captured image.

The sensor control circuitry 275 will cause the pixel array 271 tocapture an image in response to an instruction, for example, from acontrol system. The sensor control circuitry 275 controls the timing ofthe image processing provided by the analog processing circuitry 272,the ADC 273 and the digital processing circuitry 274. The sensor controlcircuitry 275 also sets the image sensor's processing parameters, suchas the gain and nature of filtering provided by the analog processingcircuitry 272 as well as the type of image processing provided by thedigital processing circuitry 274.

FIG. 19 illustrates an electrical block diagram of a luminaire employinga sensor module 280 comprising an image sensor 281 according to someembodiments. The sensor module 280 also comprises image processingcircuitry 282, which in turn includes a number of registers 283,optional supplemental image data processing circuitry 284, a controlsystem 285 and the LED array 14. The sensor module 280 may be a systemon chip (SoC) in which the image sensor 281 and processing circuitry 282are integrated onto a single chip. The supplemental image processingcircuitry 284 may be provided either together or separately from thesensor module 280. The supplemental image data processing circuitry 284may be used to offload computations related to image data and/or derivedimage data that cannot be processed by the image processing circuitry282.

In operation, the image sensor 281 is configured to capture images asdescribed above. The data from these images is sent to the imageprocessing circuitry 282. In the embodiment of FIG. 19, the image datais sent via a high speed bus 286. The image processing circuitry 282 mayperform a number of operations on the imaged data, including filteringand adjusting the image data. In some embodiments, the image processingcircuitry may address signals generated by light reflected from one ormore optics of the luminaire and/or signal generated by otherenvironmental artifacts. For example, the image processing circuitry canremove or exclude signal generated by light reflected from a glareshield employed in the luminaire architecture. The image processing mayalso remove any image distortion introduced by the asymmetrical lens.

Further, the image processing circuitry 282 may determine derived imagedata from the image data. In general, the derived image data is adownsampled form of the image data. The derived image data may beprovided in the normal course of operation of the sensor module 280. Thesupplemental image data processing circuitry 284 may perform one or morecomputations on the derived image data to determine an ambient lightlevel and/or occupancy event. However, these computations may also beperformed directly by the control system 285. Using the derived imagedata may allow the supplemental image data processing circuitry to use afirst low-speed bus 287 to communicate with the image processingcircuitry 282.

Similarly, it may also enable the control system to communicate with asecond low speed bus 288 with the supplemental image data processingcircuitry 284 and/or directly with the image processing circuitry 282.This is due to the fact that the derived image data is downsampled whencompared to the actual image data and, therefore, can be transferredquickly when compared to the actual image data. In situations whereinthe derived image data is insufficient to accurately characterize thearea surrounding the luminaire, the full image data may be transferredfrom the image processing circuitry 282 to the supplemental image dataprocessing circuitry 284 via a second high speed bus 289 for furtherreview. The image data may then be processed by the supplemental imagedata processing circuitry 284 and the necessary data sent via the secondlow speed bus 288 to the control system 285, or the full image data mayalso be sent to the control system 285, either directly from the imageprocessing circuitry 282 via a third high speed bus 290 or indirectlyfrom the supplemental image data processing circuitry 284 via the thirdhigh-speed bus 290.

The first high-speed bus 286, the second high-speed bus 289 and thethird high-speed bus 290 may be a universal serial bus (USB), aperipheral component interconnect (PCI), an external serial advancedattachment (eSATA) bus of the like. The first low-speed bus 287 andsecond low-speed bus 288 may be any number of low-speed buses known inthe art. For example, the first low-speed bus 287 and second low-speedbus 288 may be an RS-232 bus, a serial peripheral interface (SPI), a I²Cbus or the like.

Still Referring to FIG. 19 and in some embodiments, control system 285is configured to use the image data and/or the derived image data toadjust one or more light output characteristics of the LED array 292disposed on or in the luminaire. For example, the control system 285 canuse the image data and/or derived image data to adjust colortemperature, light intensity, color, vividness or the like of the lightoutput by the LED array 292. An alternating current (AC) power source291 may provide power for the control system 285 and LED array 292.Additional features of a sensor module comprising an image sensor andassociated image processing are further described in U.S. patentapplication Ser. No. 14/928,592 Nov. 5, 2015, entitled “Lighting Fixturewith Image Sensor Module” (Cree docket no. P2524US1), which isincorporated herein by reference in its entirety.

As noted above and some embodiments, sensor modules described herein canalso comprise radio frequency (RF) communication apparatus. Theluminaire, for example, can be part of a wireless distributed lightingnetwork. For example, luminaires of the network may communicate with oneanother via Institute of Electrical and Electronic Engineers standard802.15 or some variant thereof. Using a wireless mesh network tocommunicate between luminaires may increase the reliability thereof andallow the wireless lighting network to span large areas.

Examples of luminaires and wireless network architectures employing RFcommunication are provided in U.S. Patent Application Ser. No.62/292,528, titled Distributed Lighting Network (Cree docket no.P2592US1) referenced above. When RF communication apparatus is includedin the sensor module, RF-transmissive materials are can be employed inthe construction of sensor housings modules so as not to interfere withRF transmission or reception. Luminaire optics can also be constructedof RF-transmissive material RF-transmissive materials can compriseplastic or polymeric materials. In some embodiments, RF-transmissivewindows are provided in the sensor housings and/or modules describedherein. In additional embodiments, the sensor housings and modules areconstructed of metal, wherein the metal is employed as an antenna forpropagation of RF signal to and/or from the RF-communication module.

In various embodiments set forth herein, various features are describedin the following applications: Ser. No. 15/181,065 entitled “LEDLuminaire Having Enhanced Thermal Management”, filed on Jun. 13, 2016and Ser. No. 15/449,126 entitled “Image Sensor Modules and LuminairesIncorporating the Same” filed on Mar. 3, 2017, each of which is herebyincorporated by reference herein in its entirety.

In various embodiments described herein various smart technologies maybe incorporated in the lamps as described in the following applications“Solid State Lighting Switches and Fixtures Providing Selectively LinkedDimming and Color Control and Methods of Operating,” application Ser.No. 13/295,609, filed Nov. 14, 2011, which is incorporated by referenceherein in its entirety; “Master/Slave Arrangement for Lighting FixtureModules,” application Ser. No. 13/782,096, filed Mar. 1, 2013, which isincorporated by reference herein in its entirety; “Lighting Fixture forAutomated Grouping,” application Ser. No. 13/782,022, filed Mar. 1,2013, which is incorporated by reference herein in its entirety;“Multi-Agent Intelligent Lighting System,” application Ser. No.13/782,040, filed Mar. 1, 2013, which is incorporated by referenceherein in its entirety; “Routing Table Improvements for WirelessLighting Networks,” application Ser. No. 13/782,053, filed Mar. 1, 2013,which is incorporated by reference herein in its entirety;“Commissioning Device for Multi-Node Sensor and Control Networks,”application Ser. No. 13/782,068, filed Mar. 1, 2013, which isincorporated by reference herein in its entirety; “Wireless NetworkInitialization for Lighting Systems,” application Ser. No. 13/782,078,filed Mar. 1, 2013, which is incorporated by reference herein in itsentirety; “Commissioning for a Lighting Network,” application Ser. No.13/782,131, filed Mar. 1, 2013, which is incorporated by referenceherein in its entirety; “Ambient Light Monitoring in a LightingFixture,” application Ser. No. 13/838,398, filed Mar. 15, 2013, which isincorporated by reference herein in its entirety; “System, Devices andMethods for Controlling One or More Lights,” application Ser. No.14/052,336, filed Oct. 10, 2013, which is incorporated by referenceherein in its entirety; and “Enhanced Network Lighting,” applicationSer. No. 61/932,058, filed Jan. 27, 2014, which is incorporated byreference herein in its entirety.

Additionally, any of the luminaire embodiments described herein caninclude the smart lighting control technologies disclosed in U.S. PatentApplication Ser. No. 62/292,528, titled Distributed Lighting Network(Cree docket no. P2592US1), assigned to the same assignee as the presentapplication, the entirety of this application being incorporated hereinby reference.

Any of the embodiments disclosed herein may be used in a luminairehaving one or more communication components forming a part of the lightcontrol circuitry, such as an RF antenna that senses RF energy. Thecommunication components may be included, for example, to allow theluminaire to communicate with other luminaires and/or with an externalwireless controller, such as disclosed in U.S. patent application Ser.No. 13/782,040, filed Mar. 1, 2013, entitled “Lighting Fixture forDistributed Control” or U.S. Provisional Application No. 61/932,058,filed Jan. 27, 2014, entitled “Enhanced Network Lighting” both owned bythe assignee of the present application and the disclosures of which areincorporated by reference herein. More generally, the control circuitrycan include at least one of a network component, an RF component, acontrol component, and one or more sensors. A sensor, such as aknob-shaped sensor, may provide an indication of ambient lighting levelsand/or occupancy within the room or illuminated area.

The examples and figures described hereinabove are for illustrationpurposes only. Numerous modifications and adaptations will be readilyapparent to those of skill in the art without departing from the instantsubject matter. It will be understood that various details of thesubject matter described herein may be changed without departing fromthe scope of the subject matter described herein. Furthermore, theforegoing description is for the purpose of illustration only, and notfor the purpose of limitation.

1. A luminaire comprising: an electronic sensor having a sensor housingin thermal communication with a heat sink.
 2. The luminaire of claim 1,where the luminaire further comprises a luminaire housing.
 3. Theluminaire of claim 2, where the luminaire housing includes the sensorhousing.
 4. The luminaire of claim 1, where the electronic sensorcomprises drive circuitry, and a sensing device in electricalcommunication with the drive circuitry.
 5. The luminaire of claim 4where the drive circuitry comprises at least any one of a processor, acontroller, a memory element, a wireless antenna, and combinationsthereof.
 6. The luminaire of claim 1 where the heat sink is configuredto thermally insulate the electronic sensor.
 7. The luminaire of claim 1where the electronic sensor comprises at least any one of an imagesensor, a light sensor, a motion sensor, a temperature sensor, amagnetic field sensor, a gravity sensor, a humidity sensor, a moisturesensor, a vibration sensor, a pressure sensor, an electrical fieldsensor, a noise sensor, an environmental sensor, a directional sensor, aposition sensor, a velocity sensor, an airflow sensor, a chemicalsensor, a carbon dioxide sensor, an oxygen sensor, and combinationsthereof.
 8. The luminaire of claim 1 where the electronic sensorcomprises a wireless interface configured to wirelessly communicate datafrom the electronic sensor.
 9. The luminaire of claim 8, wherein theinterface comprises one or more antennae within the sensor housing. 10.The luminaire of claim 1 where the sensor housing includes at least onewall defining a cavity for accepting the electronic sensor.
 11. Theluminaire of claim 10, wherein the heat sink forms a portion of the atleast one wall.
 12. The luminaire of claim 10, wherein the at least onewall comprises an aperture.
 13. The luminaire of claim 12, wherein theaperture is configured to receive optics of a sensor.
 14. The luminaireof claim 1, wherein the heat sink is coupled to a surface of the atleast one wall.
 15. The luminaire of claim 1, wherein the heat sinkcomprises a plurality of heat dissipation structures.
 16. The luminaireof claim 15, wherein the plurality of heat dissipation structurescomprises fins.
 17. The luminaire of claim 15, wherein the plurality ofheat dissipation structures is radially arranged over the at least onewall.
 18. The luminaire of claim 1 further comprising thermallyinsulating material in the sensor housing.
 19. The luminaire of claim 1,wherein the sensor is an image sensor, and the sensor housing isintegrated with the luminaire.
 20. The luminaire of claim 1, wherein theheat sink forms one or more portions of the sensor housing.